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http://hdl.handle.net/1903/169
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| Title: | TEMPERATURE AND RATE DEPENDENT PARTITIONED CONSTITUTIVE RELATIONSHIPS FOR 95.5PB2SN2.5AG SOLDER ALLOY |
| Authors: | Gupta, Shirish Anurag |
| Advisors: | McCluskey, Patrick |
| Department/Program: | Mechanical Engineering |
| Type: | Thesis |
| Keywords: | Engineering, Mechanical (0548) |
| Issue Date: | 27-Jan-2004 |
| Abstract: | One of the biggest challenges for power electronic devices is to be reliable in harsh environments. The operating temperatures in typical applications can go as high as 200ºC. The die attachment material of a power electronic device is one of the weak links in the system. The eutectic Sn-Pb solder alloy, which is the most commonly used permanent interconnect in electronics packaging cannot fulfill these service requirements, hence there is a need to find suitable replacements.
Durability characterization is essential in order to accurately predict the reliability of the solder alloy chosen for the die attach material under life cycle loads. A large number of models are available, which can be used to determine the life of die attach in small signal and power modules, however the shortfall of these models is the lack of test data for all but the most common (e.g. eutectic Sn-Pb solder) die attach materials. Hence, relevant constitutive properties must be measured, as they are essential... |
| URI: | http://hdl.handle.net/1903/169 |
| Appears in Collections: | Mechanical Engineering Theses and Dissertations
UM Theses and Dissertations
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Size | Format | No. of Downloads |
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| dissertation.pdf | | 3012Kb | Adobe PDF | 1552 | View/Open |
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